WAFIOS, who mark the 150th anniversary of the foundation next year, exhibits BM 30. High degrees of freedom in bending head disign enables very high versatility and large bending space. Working range of wire dia. is between 2.0 - 6.5 mm. Profiled material (e.g., busbar) also can be produced by exchanging the toolings. The "iQsmartbend" by means of IOT which minimize the vibration of workpieces is must-see new technology. The samples and movies of other WAFIOS machines will be also exhibited.